Chip cover dicing machine
Keywords:
Chip cover dicing machine
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Detailed description
Product features: A wafer dicing machine for chip cover plates, handling full‑size cover plates as incoming material. Operators load the wafers manually into a stacking hopper, after which the equipment automatically picks up the wafers and performs dicing. The system then conducts visual inspection; any defective wafers are routed to a centralized reject area. Finally, the finished products are automatically placed on trays and stacked.
Customer Message
Looking ahead, Skesai will continue to forge ahead, steadfastly embracing innovative thinking, developing high‑quality new products, enhancing the company’s core competitiveness, and building a distinguished corporate brand.
No. 109, Tongxin Road, Chongchuan District, Nantong City
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